pad_4_4
Differences
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pad_4_4 [2016/08/10 23:15] latigid_on [Assembly] |
pad_4_4 [2018/03/05 22:57] latigid_on [Assembly] |
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| ===== Assembly ===== | ===== Assembly ===== | ||
| - | In order to keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ | + | To keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ |
| Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a "tack" joint, aligning the part and cleaning up if needed.\\ | Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a "tack" joint, aligning the part and cleaning up if needed.\\ | ||
pad_4_4.txt ยท Last modified: 2018/03/05 22:57 by latigid_on
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