pad_4_4
Differences
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pad_4_4 [2016/08/10 23:03] – [Assembly] latigid_on | pad_4_4 [2018/03/05 22:57] (current) – [Assembly] latigid_on | ||
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===== Assembly ===== | ===== Assembly ===== | ||
- | In order to keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ | + | To keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ |
Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a " | Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a " | ||
- | The best way to fix the 1N4148 diodes is to place the parts then solder **from the same side** | + | The best way to fix the 1N4148 diodes is to place the parts then solder **from the same side** |
- | If using shrouded headers, ensure the notch points on the same side as the pin 1 designator. | + | Check that the pinout of your pLEDs matches with the board i.e. serial in on the rounded side, serial out on the flattened side. Also test the height relative to the silicone button pad; it's not necessary to push the leads in the whole way (and you might damage your LED). |
+ | |||
+ | If using shrouded headers, ensure the notch points | ||
pad_4_4.1470870199.txt.gz · Last modified: 2016/08/10 23:03 by latigid_on