pad_4_4
Differences
This shows you the differences between two versions of the page.
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| pad_4_4 [2016/08/10 23:15] – [Assembly] latigid_on | pad_4_4 [2018/03/05 22:57] (current) – [Assembly] latigid_on | ||
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| ===== Assembly ===== | ===== Assembly ===== | ||
| - | In order to keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ | + | To keep the button pad flat, it's best to solder all components on the rear of the board i.e. opposite the pads. The contacts are exposed ENIG, so try not to damage the surface by scratching or splashing solder/flux on them.\\ |
| Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a " | Start by tinning one pad (preferably not the pad joined to the ground plane with thermals) of each 1206 capacitor, making a " | ||
pad_4_4.1470870901.txt.gz · Last modified: 2016/08/10 23:15 by latigid_on